| Production Capability | ||
|---|---|---|
| Items | Technology | |
| File types | Gerber 274-X,274 & Aperture file | |
| Material | FR-4, FR-1, CEM-1, CEM-3, Teflon | |
| Rogers,Aluminum based, Halogen Free Material | ||
| Max working panel size | 21"X24" (533mm x 609mm) | |
| Board thickness | 8-126mil (0.2-3.2mm) | |
| Layer count | 1-24 Layers | |
| Asymmetry lay-up | Yes | |
| Minimum core thickness | 3mil (0.08mm) | |
| Copper thickness | 1/2 oz(min); 4oz(max.) | |
| Minimum Line width/spacing | 3/4mil (0.08/0.10mm) | |
| Minimum hole diameter | 8mil (0.2mm) | |
| Dimension tolerance | Hole position | 3mil (+/-0.08mm) |
| Line width | +/-20% deviation of master design | |
| Hole diameter | NPTH: +/-2mil (+/-0.05mm) | |
| PTH: +/-3mil (+/-0.075mm) | ||
| Press fit: +/-2mil (+/-0.05mm) | ||
| Outline dimension | +/-5mil (+/-0.13mm) | |
| Warp and Twist | 0.75% | |
| Surface finish | HASL(Sn/Pb); HASL Lead free; | |
| Immersion Gold; Electrolytic Gold | ||
| Immersion Silver; Immersion Tin | ||
| OSP; Carbon Ink; Peelable Solder Mask | ||
| Contouring | Routing; V-CUT | |
| Beveling; punch | ||
| Minimum SMD pitch | 12mil (0.3mm) | |
| Impedance control | +/-10% | |
